Share Email Print
cover

Proceedings Paper

Hierarchical assembly for molecular electronics
Author(s): Jennifer Ayres; Brandon Walker; Kusum L. Chandra; Diana Stefanescu; Changwoong Chu; Gregory Parsons; Christopher Gorman
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Miniaturizing electronic devices to the molecular scale is the next major step in the electronics revolution. To do this, however, three major unsolved challenges must be overcome. These are: (1) Synthesis of new molecules with functionality that allows them to act as nonlinear electronic elements and to attach them in a specific orientation to contact structures (2) Bridging the molecular (created via bottom-up fabrication) with the lithographic (created via top- down fabrication) length scales for device construction and (3) definition of new lithographic approaches that accommodate molecular installation during processing. Here, an approach and its implementation will be discussed that addresses each of these issues. In addition, the approach is designed to facilitate the demonstration of gain at the molecular level which can result from a state change within the molecular architecture rather than as the response of a molecule to a change in bias of an underlying (macroscopic) gate electrode.

Paper Details

Date Published: 12 November 2005
PDF: 7 pages
Proc. SPIE 6003, Nanostructure Integration Techniques for Manufacturable Devices, Circuits, and Systems: Interfaces, Interconnects, and Nanosystems, 60030J (12 November 2005); doi: 10.1117/12.631215
Show Author Affiliations
Jennifer Ayres, North Carolina State Univ. (United States)
Brandon Walker, North Carolina State Univ. (United States)
Kusum L. Chandra, North Carolina State Univ. (United States)
Diana Stefanescu, North Carolina State Univ. (United States)
Changwoong Chu, North Carolina State Univ. (United States)
Gregory Parsons, North Carolina State Univ. (United States)
Christopher Gorman, North Carolina State Univ. (United States)


Published in SPIE Proceedings Vol. 6003:
Nanostructure Integration Techniques for Manufacturable Devices, Circuits, and Systems: Interfaces, Interconnects, and Nanosystems
Minoru M. Freund; M. Saif Islam; Achyut K. Dutta, Editor(s)

© SPIE. Terms of Use
Back to Top