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Proceedings Paper

Transmission characteristics of waveguide-embedded optical backplane system
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Paper Abstract

The performance of data and telecommunication equipment must keep up with the increasing network speed. Optical interconnection technology is a promising alternative for high throughput systems. The Optical backplane system was demonstrated with waveguide-embedded optical backplane, transmitter board and receiver board. The transmitter and receiver module were prepared for optical PCB, which consists of the metal optical bench, the driver chips, VCSELs, photodiodes and a tapered polymeric waveguide. And parallel optical transmitter and a receiver module were attached onto the processing boards for the interconnection with optical backplane board. The tapered polymeric waveguides are fabricated using the hot embossing technique. And the propagation loss of the waveguide was approximately 0.1dB/cm at 850nm. The waveguide-embedded optical backplane boards were fabricated by using conventional PCB lamination process. The data transmission characteristics of the processing board have been investigated. In our optical backplane system, we demonstrated up to 10Gb/s 27-1 PRBS NRZ data transmission from the transmitter board to the receiver board through optical backplane. The BERs were less than 10-12 under 8Gb/s data rate, which is sufficient level for telecommunications.

Paper Details

Date Published: 17 November 2005
PDF: 6 pages
Proc. SPIE 5999, Intelligent Systems in Design and Manufacturing VI, 59990X (17 November 2005); doi: 10.1117/12.630313
Show Author Affiliations
Seung-Ho Ahn, Electronics and Telecommunications Research Institute (South Korea)
In-Kui Cho, Electronics and Telecommunications Research Institute (South Korea)
Woo-Jin Lee, Electronics and Telecommunications Research Institute (South Korea)
Sang-Pil Han, Electronics and Telecommunications Research Institute (South Korea)
Keun-Byoung Yoon, Kyungpook National Univ. (South Korea)
Myung-Yung Jeong, Pusan National Univ. (South Korea)
Man-Seop Lee, Information and Communications Univ. (South Korea)


Published in SPIE Proceedings Vol. 5999:
Intelligent Systems in Design and Manufacturing VI
Bhaskaran Gopalakrishnan, Editor(s)

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