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Proceedings Paper

Fully optical backplane system using novel optical plug and slot
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Paper Abstract

A fully optical PCB with transmitter/receiver system boards and optical bakcplane was prepared, which is board-to-board interconnection by an optical slot. We report a 10 Gb/s PRBS NRZ data transmission between transmitter system board and optical backplane embedded multimode polymeric waveguide arrays. The basic concept of the optical PCB is as follows; 1) Metal optical bench is integrated with optoelectronic devices, driver and receiver circuits, polymeric waveguide and access line PCB module. 2) Multimode polymeric waveguide inside an optical backplane, which is embedded into PCB, 3) Optical slot and plug for high-density (channel pitch : 500 um) board-to-board interconnection. The polymeric waveguide technology can be used for transmission of data between transmitter/receiver processing boards and backplane boards. The main components are low-loss tapered polymeric waveguides and a novel optical plug and slot for board-to-board interconnections, respectively. The transmitter/receiver processing boards are designed as plug types, and can be easily plugged-in and -out at an optical backplane board. The optical backplane boards are prepared by employing the lamination processes for conventional electrical PCBs. A practical optical backplane system was implemented with two processing boards and an optical backplane. As connection components between the transmitter/receiver processing boards and backplane board, optical slots made of a 90°-bending structure-embedded optical plug was used. A 10 Gb/s data link was successfully demonstrated. The bit error rate (BER) was determined and is 5.6×10-9(@10Gb/s) and the BER of 8 Gb/s is < 10-12.

Paper Details

Date Published: 24 October 2005
PDF: 9 pages
Proc. SPIE 6014, Active and Passive Optical Components for WDM Communications V, 60140I (24 October 2005); doi: 10.1117/12.630311
Show Author Affiliations
In-Kui Cho, ETR (South Korea)
Information and Communications Univ. (South Korea)
Seung-Ho Ahn, ETR (South Korea)
Woo-Jin Lee, ETR (South Korea)
Sang-Pil Han, ETR (South Korea)
Jin-Tae Kim, ETR (South Korea)
Chun-Ki Choi, ETR (South Korea)
Kyung-Up Shin, Samsung Electro-Mechanics Co. (South Korea)
Keun Byoung Yoon, Kyungpook National Univ. (South Korea)
Myung-Yung Jeong, Pusan National Univ. (South Korea)
Hyo Hoon Park, Information and Communications Univ. (South Korea)

Published in SPIE Proceedings Vol. 6014:
Active and Passive Optical Components for WDM Communications V
Achyut K. Dutta; Yasutake Ohishi; Niloy K. Dutta; Jesper Moerk, Editor(s)

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