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Proceedings Paper

A new architecture for board-level optical wirings applying optical pin and self-written waveguide
Author(s): Osamu Mikami
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Paper Abstract

The potential of the optical circuit packaging technology is discussed. Special attention has been paid to introduction of "Optical wiring" into the Printed Wiring Board level ("last 1 meter area") to overcome conventional electrical copper-based bandwidth limitations. Optical Surface Mount Technology (O-SMT) can be one of possible solutions in this field is reviewed. High efficiency and alignment-free coupling between optical wirings and optical devices is a key. O-SMT requires a method to change the beam direction from the horizontal to the vertical and vice verse in order to couple between optical wirings in an OE-board and OE-devices mounted on the board. A novel method using an "Optical Pin" has been proposed and investigated. Furthermore, an optical coupling method using a Self-Written Waveguide called "Optical Solder" has been investigated. Several applications of self-written waveguides using a green-laser and a photo-mask are demonstrated.

Paper Details

Date Published: 24 October 2005
PDF: 13 pages
Proc. SPIE 6014, Active and Passive Optical Components for WDM Communications V, 60140L (24 October 2005); doi: 10.1117/12.629312
Show Author Affiliations
Osamu Mikami, Tokai Univ. (Japan)


Published in SPIE Proceedings Vol. 6014:
Active and Passive Optical Components for WDM Communications V
Achyut K. Dutta; Yasutake Ohishi; Niloy K. Dutta; Jesper Moerk, Editor(s)

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