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Proceedings Paper

384x288 MCT LWIR FPA
Author(s): K. O. Boltar; I. D. Burlakov; S. V. Golovin; N. I. Yakovleva; L. D. Saginov; V. M. Akimov
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Paper Abstract

LWIR staring 384x288 focal plane array (FPA) has been developed and investigated. FPAs are manufactured on the basis of mercury cadmium telluride epitaxial layers grown both by liquid phase epitaxy (LPE) and molecular beam epitaxy (MBE). 384x288 FPA consists of a MCT photodiodes array formed in the p-type layer by ion implantation and silicon readout integrated circuit (ROIC). The photodiodes array pitch in each direction is 28 μm. ROIC performs the photocurrents integration during row period, signals multiplexing in two output channels from the focal plane. MCT photovoltaic array and ROIC are bonded by indium bumps. This photosensitive assembly is packaged in vacuum metal encapsulation and cooled down to temperature 80 K. Average detectivity was of 4.4.1010 W-1.cm.Hz1/2 for FPA cutoff wavelength of 10.7 μm. Test IR system on the basis of FPA was developed to obtain thermal images in real time mode at frame frequency 50 Hz. Test IR system performs two-point correction and defective elements replacement.

Paper Details

Date Published: 29 September 2005
PDF: 6 pages
Proc. SPIE 5957, Infrared Photoelectronics, 59570H (29 September 2005); doi: 10.1117/12.625145
Show Author Affiliations
K. O. Boltar, ORION Research Development and Production Ctr. (Russia)
I. D. Burlakov, ORION Research Development and Production Ctr. (Russia)
S. V. Golovin, ORION Research Development and Production Ctr. (Russia)
N. I. Yakovleva, ORION Research Development and Production Ctr. (Russia)
L. D. Saginov, ORION Research Development and Production Ctr. (Russia)
V. M. Akimov, ORION Research Development and Production Ctr. (Russia)


Published in SPIE Proceedings Vol. 5957:
Infrared Photoelectronics
Antoni Rogalski; Eustace L. Dereniak; Fiodor F. Sizov, Editor(s)

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