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Proceedings Paper

DUV-microscope objectives: technology driver that forces the production to switch from the micrometer scale to the nanometer scale
Author(s): Thomas Sure; Tobias Bauer; Joachim Heil; Joachim Wesner
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Paper Abstract

Cemented doublets and triplets can not be used for objectives working at wavelengths of 248 nm and shorter, because the optical cement can not withstand the high photon energies. It will be shown that high NA deep UV objectives can be designed and built successfully with the help of air spaced doublets. Assuring Strehl ratios above 95% enforces very tight tolerances. For example the distance error of the lens vertex to its mount has to be less than 1 μm. This calls for a new manufacturing precision never realized before in series production. We show how a white light Mirau interferometer can be used to measure lens vertex positions with an accuracy of 200 nm. We also demonstrate how the fine-tuning process can be optimized by using a "simulated star test", where the point-spread function is calculated in real time with a FFT-algorithm from the optical path difference data, acquired by a Twyman-Green interferometer. To realize the required precision, today various measurement techniques and production processes are used. Picking up the subgroups on different machining tools and measurement systems will loosen the accuracy. Here, we present the concept and the layout of a new manufacturing tool where we implemented the different measurement techniques needed in one CNC machining center. This tool is able to 1) adjust automatically the optical axis of the subgroups related to the machining axis better than 0.5 μm with the help of the stick-slip effect where a mechanical impulse is transferred by an electromagnetically driven hammer, 2) measure the lens vertex relative to the shoulder of the mount with an accuracy of 250 nm and 3) do all steps which are necessary to process the lens mount within the accuracies described above.

Paper Details

Date Published: 20 October 2005
PDF: 14 pages
Proc. SPIE 5965, Optical Fabrication, Testing, and Metrology II, 59651H (20 October 2005); doi: 10.1117/12.625009
Show Author Affiliations
Thomas Sure, Leica Microsystems CMS GmbH (Germany)
Tobias Bauer, Leica Microsystems CMS GmbH (Germany)
Joachim Heil, Leica Microsystems CMS GmbH (Germany)
Joachim Wesner, Leica Microsystems CMS GmbH (Germany)

Published in SPIE Proceedings Vol. 5965:
Optical Fabrication, Testing, and Metrology II
Angela Duparré; Roland Geyl; Lingli Wang, Editor(s)

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