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Proceedings Paper

Optical full-field technique for measuring deformation on micromechanical components
Author(s): Xide Li; Cheng Wei
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Paper Abstract

The rapid development of microelectromechanical system (MEMS), thin-film and material research in mechanical behaviors has provided new impetus to handle high-precision, full-filed and real-time deformation measurements. Optical methods are very useful in non-contact and full-field measurements of the deformation of an object. However, with the decrease of the dimension of the tested components, the macroscopically testing method and system in existence are not adequate to accurate measurement of the microcomponents. Furthermore, the effect of the small size of view field in the measurement makes the interferometric system hardly producing clear and stable fringe patterns, and then interpretation of the measurement results very difficult. In this paper, a Linnik microinterferometric system has been constructed to measure the full-field deformation of microcomponents. And meanwhile, the phase shifting and temporal speckle pattern interferometry are also introduced to implement the static and dynamic deformation measurements. With the interfermetric system, the characteristic size of the microcomponents can be from sub-millimeters to sever micrometers.

Paper Details

Date Published: 12 April 2005
PDF: 7 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621982
Show Author Affiliations
Xide Li, Tsinghua Univ. (China)
Cheng Wei, Tsinghua Univ. (China)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

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