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Proceedings Paper

Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method
Author(s): C. N. Sim; Cho Jui Tay; L. Cheng
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Paper Abstract

Residual stresses is measured using a new technique combining hole indentation with Electronic Speckle Pattern Interferometry (ESPI). The technique is superior to conventional methods such as the widely used rosette strain-gage hole drilling technique in the ease of experimental set up and the use of optics in strain measurement allows results to be displayed in real-time. The technique is fast, simple, less destructive and has great potential to be developed into a quality inspection tool in the production/field environment.

Paper Details

Date Published: 12 April 2005
PDF: 7 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621936
Show Author Affiliations
C. N. Sim, Singapore Technologies Kinetics Ltd. (Singapore)
Cho Jui Tay, National Univ. of Singapore (Singapore)
L. Cheng, National Univ. of Singapore (Singapore)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

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