Share Email Print
cover

Proceedings Paper

Finite element study of flip chip on board in drop test
Author(s): Siew Kuan Nah; Zhaowei Zhong
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The reliability of electronic packages in mechanical drop tests is critical especially for portable electronic devices as these electronic packages are very vulnerable to solder joint failures caused by the mechanical shock and the PCB warping upon impact. Drop test studies are performed to investigate the solder joints mechanical failure in electronic packages. In this paper, the mechanical impact on the solder joints of a flip chip in a simulated drop test is investigated. The drop test simulation consists of a typical flip chip on board (FCOB) that has 48 peripheral eutectic solder bumps modeled in CAD/CAM software. The flip chip solder joint reliability under mechanical shock is studied using 3D finite element simulation. Comprehensive design analyses are performed to study 3 different models. The design models are varied in the substrate dimensions and the addition of encapsulation. The results of the stresses and strains in the solder joints are obtained using finite element analysis in the drop test. The findings indicate that the stress on the flip chip corner solder joint decreases if the substrate is larger in dimension. In addition, the introduction of an encapsulation helps to reduce the stress experienced by the solder joint.

Paper Details

Date Published: 12 April 2005
PDF: 7 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621927
Show Author Affiliations
Siew Kuan Nah, Nanyang Technological Univ. (Singapore)
Zhaowei Zhong, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

© SPIE. Terms of Use
Back to Top