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Proceedings Paper

Nanomechanical testing of polymeric nanofibers
Author(s): E. P. S. Tan; C. T. Lim
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Paper Abstract

Biodegradable polymeric nanofibrous scaffold comprises individual nanofibers where their stiffnesses can promote or undermine the various cellular functions as well as structural integrity of the scaffold. As such, there is a need to investigate the nanomechanical properties of these individual nanofibers. However, conducting mechanical tests of individual fibers at the nanometer scale can pose great challenges and difficulties. Here, we present novel techniques to perform nanomechanical testing of individual polymeric nanofibers. For demonstration of the nano tensile tests, polycaprolactone (PCL) nanofibers were produced via electrospinning. These fibers were deposited across two parallel edges of a cardboard frame so that a single nanofiber can be isolated for tensile test using a nano tensile tester. For nanoscale three-point bend test, a Poly (L-lactic acid) (PLLA) nanofiber was suspended across a microsized groove etched on a silicon wafer. An atomic force microscope (AFM) tip was then used to apply a point load on the mid-span of the suspended fiber. Beam bending theory was then used to calculate the elastic modulus of the nanofiber. For nanoindentation test, a PLLA nanofiber was deposited on a mica substrate and an AFM tip used to indent the nanofiber. Modified Hertz theory for normal contact was then used to evaluate the elastic modulus of the nanofiber.

Paper Details

Date Published: 12 April 2005
PDF: 7 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621921
Show Author Affiliations
E. P. S. Tan, National Univ. of Singapore (Singapore)
C. T. Lim, National Univ. of Singapore (Singapore)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

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