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Proceedings Paper

A new method to measure the distance between the micro-device and the substrate
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Paper Abstract

A technique for measuring the distance between the micro-device and substrate is developed. An electron beam scan of a scanning electron microscope used for this method. A micro-device is placed over the substrate and obstructs the back-scattered electrons from the substrate. Therefore, the shadow image of the micro-device is observed in the SEM image. The distance between the micro-device and the substrate can be calculated using the width of the shadow, dimension of the detectors for the back-scattered electrons and the dimension of the micro-devices. This method makes it possible not only to measure the distance between the micro-device and the substrate and also detect the form of the specimen surface. In addition, observation of the micro-devices and measuring the distance between the micro-device and the substrate can perform at the same time. As a demonstration, the distance between the micro-bar and the substrate and the shape of the micro-hardness tester's indent mark is measured.

Paper Details

Date Published: 12 April 2005
PDF: 5 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621892
Show Author Affiliations
Satoshi Kishimoto, National Institute for Materials Science (Japan)
George C. Johnson, Univ. of California/Berkeley (United States)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics

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