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Proceedings Paper

Ultrasonic weak bond evaluation in IC packaging
Author(s): Xiaoming Jian; N. Guo; Steve Dixon
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Paper Abstract

Air gap such as disbond and crack can be successfully detected by ultrasonic testing. But imperfect interface evaluation is still a challenge. The challenge arises from the uncertainty of formation mechanism, boundary condition and acoustical response. In the paper, samples of structure silicon/adhesive/lead-frame, typical in IC packaging, are fabricated with two adhesives, degraded through thermo cycling, examined by acoustical waveform and C-imaging, and compared to the measured optical microscopy image and the measured failure shear strength.

Paper Details

Date Published: 12 April 2005
PDF: 6 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621561
Show Author Affiliations
Xiaoming Jian, Univ. of Warwick (United Kingdom)
N. Guo, Nanyang Technological Univ. (Singapore)
Steve Dixon, Univ. of Warwick (United Kingdom)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics

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