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Proceedings Paper

Deformation field measurement on micro and nanotechnology components utilizing SFM and FIB equipment
Author(s): Dietmar Vogel; Juergen Keller; Astrid Gollhardt; Bernd Michel
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Paper Abstract

The authors present a digital image correlation (DIC) tool, which allows to measure deformation fields on micro and nano system components under thermal and/or mechanical impact. Load state micrographs are used to extract displacement and strain fields. An earlier developed DIC concept for that purpose has been extended from SEM to AFM and FIB imaging. As a consequence ultimate measurement resolution can be achieved by AFM imaging. The advantages of the new focused ion beam (FIB) approach occur in the incorporation of specimen preparation (ion milling, ion beam surface polishing and DIC patterning), specimen loading by ion milling and DIC deformation measurement in a single equipment. The application of DIC techniques on AFM base is illustrated for the investigation of thermal deformations on microsystem structures as well as for the evaluation of microcracks from crack opening displacements. Some first results for residual stress release by ion milling with subsequent deformation field measurement are reported, too.

Paper Details

Date Published: 12 April 2005
PDF: 7 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621539
Show Author Affiliations
Dietmar Vogel, Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration (Germany)
Juergen Keller, Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration (Germany)
Astrid Gollhardt, Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration (Germany)
Bernd Michel, Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration (Germany)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

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