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Proceedings Paper

Mechanical properties of lead-free solder alloys evaluated by miniature size specimen
Author(s): Yoshiharu Kariya; Tsuyoshi Asai; Tadatomo Suga
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Paper Abstract

Tensile and fatigue testing using miniature specimen was proposed to compare the mechanical behaviors of Sn-3.0%Ag-0.5%Cu alloy in small and large volumes respectively. It was found that the tensile strength data of the miniature specimen was not similar with clear inferiority to that of the large volume under all test conditions. The differences in their mechanical properties are attributed to dendrite morphology and intermetallic compounds size. Thus, the mechanical behavior and the solidification microstructure strongly depend on specimen volume, which suggests that small size be used to measure mechanical behaviors of solder alloys.

Paper Details

Date Published: 12 April 2005
PDF: 5 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621538
Show Author Affiliations
Yoshiharu Kariya, National Institute for Materials Science (Japan)
Tsuyoshi Asai, National Institute for Materials Science (Japan)
Tadatomo Suga, The Univ. of Tokyo (Japan)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

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