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Proceedings Paper

A combined fiber optic digital shearography and holography system for defect inspection in Si-wafers
Author(s): Ganesha Udupa; Jun Wang; Bryan Kok Ann Ngoi
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Paper Abstract

The present work relates to surface and/or subsurface defects inspection system for semiconductor industries and particularly to an inspection system for a defect such as swirl defects and particles in an unpolished silicon wafer before the wafer fabrication process by a combined fiber optic digital shearography and holography technique. The dual purpose camera described in this paper gives the possibility of using either digital shearography or holography (DSPI) techniques depending on application needs. The sub-surface defects in a wafer normally create strain concentrations subjected to loading (stressing) which are translated into anomalies in the fringe pattern. A real time technique with the use of Lab view Express 7 software is developed to detect defects in Si-wafer with the application of thermal oading as a stressing method. The results obtained by applying a real time fiber optic shearography technique are described in this paper. The method described here relates specifically to semiconductor wafers, but may be generalized to any other samples.

Paper Details

Date Published: 12 April 2005
PDF: 7 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621526
Show Author Affiliations
Ganesha Udupa, Nanyang Technological Univ. (Singapore)
Jun Wang, Nanyang Technological Univ. (Singapore)
Bryan Kok Ann Ngoi, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

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