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Proceedings Paper

3-D stress analysis using the Jones matrix image Fourier polarimetry technique
Author(s): Souichirou Katsumata; Kenichi Sakaue; Masahisa Takashi
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Paper Abstract

Although various kinds of optical techniques for the analysis of 3-D stress fields have been proposed up to date, they are still far from being satisfied. The integrated photoelastic technique is widely adopted in the analysis of 3-D stress field over the world including the Jones matrix image Fourier polarimetry Technique in this study. In the previous research, it has been confirmed that three optical parameters which has been related to stress components, can be measured in high accuracy, and the separation of stress components by the Simplex method was examined. Moreover, the authors successfully separated and determined the optical parameters in each laminated thin disk loaded in different directions each other standing on the equivalence theorem in polarimetry. In this paper, the authors evaluate laminated layer 2-D stress fields in a set of 3 sliced disks and compare them with an actual 3-D stress field under an equivalent loading condition. Namely, disks made of quartz 2mm and 3mm in thickness were loaded at several locations and directions to realize 3-D stress field. A 3-D stress field on laminated layers model was loaded in the similar condition. Since the phase difference and azimuth angle are measured in high accuracy, the technique is expected to be an effective technique for the analysis of actual 3-D stress field.

Paper Details

Date Published: 12 April 2005
PDF: 6 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621520
Show Author Affiliations
Souichirou Katsumata, Aoyama Gakuin Univ. (Japan)
Kenichi Sakaue, Aoyama Gakuin Univ. (Japan)
Masahisa Takashi, Aoyama Gakuin Univ. (Japan)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

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