Share Email Print
cover

Proceedings Paper

Vibration analysis of gyro sensors by using ESPI technique
Author(s): Seon-il Ham; Jae-huk Lee; Sang-duck Park
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Recently, micro gyroscope sensors are adopted in handy camcorders to compensate external shock or vibration such as hand shakes. In developing micro gyroscope sensors, vibration analysis is inevitable but not easy since the micro gyroscope sensors are too small. In this paper, non-contact full-field ESPI (Electronic speckle pattern interferometry) measurement technique is introduced in vibration analysis of micro gyroscope sensors. Resonant frequencies and ODS(Operational deflection shapes) are measured and compared to each other. It is found that structure and PCB molding mass is one of most sensitive factors in designing micro gyroscope sensors.

Paper Details

Date Published: 12 April 2005
PDF: 3 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621488
Show Author Affiliations
Seon-il Ham, Samsung Electronics Co., Ltd. (South Korea)
Jae-huk Lee, Samsung Electronics Co., Ltd. (South Korea)
Sang-duck Park, Samsung Electronics Co., Ltd. (South Korea)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

© SPIE. Terms of Use
Back to Top