Share Email Print
cover

Proceedings Paper

Modified single lap joint (MSLJ) test configuration for the determination of adhesive fracture energy
Author(s): S. B. Kumar; I. Sridhar; S. Sivashanker; Asim Bag; S. O. Osiyemi
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

In this work, a modification has been proposed to the traditional single lap joint (SLJ) configuration, to overcome the wide scatter in the fracture toughness measurement due to adhesive fillets. This modification, referred to as the Modified Single Lap Joint (MSLJ), is made by implanting end pre-cracks in the adhesive layer at the center of the bond line in a conventional SLJ. This ensured that during testing, the crack propagated from both ends of the overlap and reduced the effect of spew fillets. MSLJ joints made from unidirectional fibre composite substrates (913C - HTA 12K 5-34%) and either of two types of (Redux 322 and Redux 335K) film adhesive were tested to measure the adhesive fracture energy, Gac. The values of Gac measured were compared with those from similar tests conducted on SLJ and double cantilever beam (DCB) configurations. It was observed that the scatter in the fracture energy measurements obtained from the MSLJ specimens were reduced by more than 30% in comparison with those from the SLJ specimens. The values of adhesive fracture energy from the MSLJ and DCB test geometries were in good agreement. These results are especially useful in the critical design of structural components for aerospace and defense applications as a typical design engineer can use the value of Gac to design for how long an adhesively bonded joint will last when subjected to stresses in friendly or hostile environments.

Paper Details

Date Published: 12 April 2005
PDF: 9 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621427
Show Author Affiliations
S. B. Kumar, Nanyang Technological Univ. (Singapore)
I. Sridhar, Nanyang Technological Univ. (Singapore)
S. Sivashanker, Nanyang Technological Univ. (Singapore)
Asim Bag, Det Norske Veritas Pte Ltd. (Singapore)
S. O. Osiyemi, Composite Technology Education & Consultancy Pte Ltd. (Singapore)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

© SPIE. Terms of Use
Back to Top