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Proceedings Paper

Development of laser scissors for carbon and silicon carbide fiber cutting
Author(s): Hiroshi Murotani; Hironobu Sakata; Akira Yoshikado; Moriaki Wakaki
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Paper Abstract

Laser cutting of carbon (C) and silicon carbide (SiC) fibers was performed using a second harmonic generation (SHG) sheet beam of Q-switched Nd:YAG laser with an out put energy of 4J/pulse, pulse width of 10ns and a fluence of 3.0J/cm2. The beam was irradiated respectively on monofibers of C and SiC placed on an optical glass slide in air at room temperature. A single pulse was irradiated every one second and repetition number of shot pulses N was varied from N=10 to 40 pulses. Cutting of C and SiC fibers occurred for N = 20-40 pulses. A cut portion of C fiber fixed on the substrate for one end in tension free was found to have very sharp wedge like profile. Laser irradiation for C fiber fixed with both ends on the substrate made the fiber fractured with thinner fiber diameter. Similar profile was also observed in a SiC fiber at the cut portion. Smooth flat surface of laser cut portion of C and SiC fibers suggested a laser ablation by evaporation. In the SiC fiber, sticky and viscous layer was observed at the cut surface, suggesting vitreous silica formed by oxidation of laser-irradiated fiber.

Paper Details

Date Published: 22 August 2005
PDF: 6 pages
Proc. SPIE 5869, Optical Manufacturing and Testing VI, 58691G (22 August 2005); doi: 10.1117/12.618118
Show Author Affiliations
Hiroshi Murotani, Tokai Univ. (Japan)
Hironobu Sakata, Tokai Univ. (Japan)
Akira Yoshikado, Toyo Precision Parts Mfg. Co. Ltd. (Japan)
Moriaki Wakaki, Tokai Univ. (Japan)


Published in SPIE Proceedings Vol. 5869:
Optical Manufacturing and Testing VI
H. Philip Stahl, Editor(s)

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