Share Email Print
cover

Proceedings Paper

Novel silicone materials for LED packaging
Author(s): Ann W. Norris; Maneesh Bahadur; Makoto Yoshitake
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Silicone based materials have attracted considerable attention from Light Emitting Diode (LED) manufacturers for use as encapsulants and lenses for many next generation LED device designs. Silicones can function in several roles that include protective lenses, stress relieving encapsulants, mechanical protection and light path materials. The key attributes of silicones that make them attractive materials for high brightness (HB) LEDs include their high transparency in the UV-visible region, controlled refractive index (RI), stable thermo-mechanical properties, and tuneable hardness from soft gels to hard resins. The high current and high operating temperatures of HB-LEDs present a significant materials challenge for traditional organic materials such as epoxies, acrylics and cyclo olefin copolymers (COC) that lack the thermal and molecular stability needed to provide optical clarity and mechanical performance required for next generation devices. In addition, the retention of optical clarity over the lifetime of the device, which involves long term exposure to high flux in the UV-visible wavelength region, is a critical requirement. Silicones have been demonstrated to provide the required stability. This paper will describe recent silicone materials development efforts directed towards providing LED manufacturers with silicone materials solutions for LED device fabrication. Injection molding of novel silicone resin based materials will be discussed as a surmountable challenge for high throughput LED device manufacturing.

Paper Details

Date Published: 14 September 2005
PDF: 7 pages
Proc. SPIE 5941, Fifth International Conference on Solid State Lighting, 594115 (14 September 2005); doi: 10.1117/12.617250
Show Author Affiliations
Ann W. Norris, Dow Corning Corp. (United States)
Maneesh Bahadur, Dow Corning Corp. (United States)
Makoto Yoshitake, Dow Corning Toray (Japan)


Published in SPIE Proceedings Vol. 5941:
Fifth International Conference on Solid State Lighting
Ian T. Ferguson; John C. Carrano; Tsunemasa Taguchi; Ian E. Ashdown, Editor(s)

© SPIE. Terms of Use
Back to Top