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Proceedings Paper

AUV5500: advanced in situ dry cleaning and metrology process for next generation lithography
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Paper Abstract

Today, the industry is suffering from the consequences of residue and contaminants on the mask surface as they significantly affect the printing quality of the reticle. Thus a good control of the mask cleanliness via its optical properties is becoming essential to minimize this impact. The AUV5500 is specifically addressing organic contaminants. The principle of the tool set-up, its process functionality is presented. Preliminary data on the impact of organic contaminants on binary and embedded phase shift masks optical properties and the tool cleaning capability are analyzed and discussed.

Paper Details

Date Published: 28 June 2005
PDF: 9 pages
Proc. SPIE 5853, Photomask and Next-Generation Lithography Mask Technology XII, (28 June 2005); doi: 10.1117/12.617119
Show Author Affiliations
Christian Chovino, Advanced Mask Technology Ctr. GmbH and Co. KG (Germany)
Stefan Helbig, STEAG HamaTech AG (Germany)
Peter Dress, STEAG HamaTech AG (Germany)


Published in SPIE Proceedings Vol. 5853:
Photomask and Next-Generation Lithography Mask Technology XII
Masanori Komuro, Editor(s)

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