Share Email Print
cover

Proceedings Paper

Cryogenic aerosol cleaning of photomasks
Author(s): S. Banerjee; C. C. Lin; S. Su; H. F. Chung; W. Brandt; K. Tang
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

This paper describes the mechanism and cleaning results of a dry cleaning technology using CO2 cryogenic aerosols. The cleaning mechanism relies on momentum transfer from the aerosol particles to overcome the force of adhesion of the contaminant particles on the surface. Particle removal is possible without degradation or etching of underlying film or the need for drying with IPA as in wet cleaning. A theoretical model of particle removal based on momentum transfer is described, predicting higher removal efficiency for sub-micron particles compared to larger particles. Experimental results with Si3N4 particles on silicon wafers show that removal of sub-micron particles is 10% higher than larger particles up to 30 μm, as predicted by the model. The paper also shows experimental results of various types of contaminant particle removal in photomask cleaning. Results of post mechanical repair cleaning of photomasks show effective removal of the quartz particles without damage to the adjacent chrome lines. Inorganic contaminants such as ammonium sulphate, commonly known as "haze", is removed by cryogenic aerosol cleaning with 99% efficiency as seen using optical inspection tool. The effect of cleaning on the phase and transmission of the mask is measured with multiple cleaning. The results show that over 16 cleaning cycles, the change in transmission is 0.04% an the change in phase is 0.37°. Thus a non-invasive cleaning for sub-micron particles from photomasks is possible with CO2 cryogenic aerosols.

Paper Details

Date Published: 28 June 2005
PDF: 10 pages
Proc. SPIE 5853, Photomask and Next-Generation Lithography Mask Technology XII, (28 June 2005); doi: 10.1117/12.617081
Show Author Affiliations
S. Banerjee, Eco-Snow Systems (United States)
C. C. Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
S. Su, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
H. F. Chung, Eco-Snow Systems (United States)
W. Brandt, Eco-Snow Systems (United States)
K. Tang, BOC Edwards (Singapore)


Published in SPIE Proceedings Vol. 5853:
Photomask and Next-Generation Lithography Mask Technology XII
Masanori Komuro, Editor(s)

© SPIE. Terms of Use
Back to Top