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Proceedings Paper

CESIC: a new technology for lightweight and cost effective space instrument structures and mirrors
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Paper Abstract

For some years Alcatel Space has been interested in the development of a new material to produce lightweight, stiff, stable and cost effective structures and mirrors for space instrument. Cesic from ECM has been selected for its intrinsic properties (high specific modulus, high conductivity, quite low thermal expansion coefficient and high fracture toughness for a ceramic material), added to ample manufacturing capabilities. Under ESA responsibility, a flight representative optical bench of Cesic has been designed, manufactured and tested. The optical bench has been submitted with success to intensive vibration tests up to 80 g on shaker without problem and was tested down to 30 K showing very high stability. Cesic is also envisaged for large and lightweight space telescope mirrors. Coatings on the Cesic substrate have been developed and qualified for the most stringent optical needs. To prove the lightweight capability, a large Cesic mirror D=950 mm with an area mass of less than 25 kg/m2 has been designed, sized again launch loads and WFE performance, and then manufactured. Cesic is also envisaged for large future focal plane holding a large number of detectors assuring high stability thanks to its high thermal conductivity. A full size Cesic focal plane has been already successfully built and tested. Based on these successful results, Alcatel Space is now in position to propose for space projects this technology mastered in common with ECM both for mirrors and structures with new innovative concepts thanks to the manufacturing capabilities of this technology.

Paper Details

Date Published: 18 August 2005
PDF: 15 pages
Proc. SPIE 5868, Optical Materials and Structures Technologies II, 58680F (18 August 2005); doi: 10.1117/12.616535
Show Author Affiliations
Christophe Devilliers, Alcatel Space (France)
Matthias R. Kroedel, ECM (Germany)

Published in SPIE Proceedings Vol. 5868:
Optical Materials and Structures Technologies II
William A. Goodman, Editor(s)

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