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Proceedings Paper

The heat dissipation performance of LED applied a MHP
Author(s): Gwo-Jiun Sheu; Farn-Shiun Hwu; Shen-Hang Tu; Wen-Tung Chen; Jenq-Yang Chang; Jyh-Chen Chen
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Paper Abstract

This study will discuss the heat dissipation effect of light emitting diode (LED) device applied a commercial miniature heat pipe (MHP). For lowering the thermal resistance of LED, the MHP can reduce the working temperature and raise the allowable input power of LED chip obviously. By comparing with a copper rod, the LED temperature was decreased about 19% at 1.59W input power and the LED power was increased about 43% under 118°C chip temperature. On the other hand, the thermal resistance of LED also can be reduced by using a thinner slug. Moreover, the results showed that the thermal spreading effect was significant. The MHP could be used to avoid the hot spot of LED packaging due to its excellent heat spreading property. Simultaneously, a LED thermal simulation was carried out to verify the optimum value of slug thickness.

Paper Details

Date Published: 14 September 2005
PDF: 8 pages
Proc. SPIE 5941, Fifth International Conference on Solid State Lighting, 594113 (14 September 2005); doi: 10.1117/12.616355
Show Author Affiliations
Gwo-Jiun Sheu, National Central Univ. (Taiwan)
Farn-Shiun Hwu, National Central Univ. (Taiwan)
Nanya Institute of Technology (Taiwan)
Shen-Hang Tu, National Central Univ. (Taiwan)
Wen-Tung Chen, National Central Univ. (Taiwan)
Jenq-Yang Chang, National Central Univ. (Taiwan)
Jyh-Chen Chen, National Central Univ. (Taiwan)

Published in SPIE Proceedings Vol. 5941:
Fifth International Conference on Solid State Lighting
Ian T. Ferguson; John C. Carrano; Tsunemasa Taguchi; Ian E. Ashdown, Editor(s)

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