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Proceedings Paper

Radiation thermometry for silicon wafers
Author(s): T. Iuchi; Y. Ikeda; K. Hiraka
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Paper Abstract

Emissivity and transmissivity of a silicon wafer were studied during the growth of thin oxide films from the viewpoint of spectral, directional and polarized characteristics of thermal radiation. Experimental results were mostly coincident with simulated results. By using a simulation model to estimate the optical properties of silicon wafers, a direct relationship was found between the ratio of p- to s-polarized radiance and the polarized emissivity under specific conditions. This relationship was experimentally confirmed at high temperatures (> 900 K). On the basis of these results, the present study proposes a new radiation thermometry technique that can measure the temperature and spectral emissivity of a silicon wafer at a wavelength of 0.9 μm and at moderately high temperatures, irrespective of the variation in emissivity with oxide film thickness.

Paper Details

Date Published: 1 September 2005
PDF: 10 pages
Proc. SPIE 5878, Advanced Characterization Techniques for Optics, Semiconductors, and Nanotechnologies II, 587819 (1 September 2005); doi: 10.1117/12.613857
Show Author Affiliations
T. Iuchi, Toyo Univ. (Japan)
Y. Ikeda, Toyo Univ. (Japan)
K. Hiraka, Toyo Univ. (Japan)

Published in SPIE Proceedings Vol. 5878:
Advanced Characterization Techniques for Optics, Semiconductors, and Nanotechnologies II
Angela Duparre; Bhanwar Singh; Zu-Han Gu, Editor(s)

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