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Proceedings Paper

Performance evaluation of a residual stress measurement device using indentation and a radial in-plane ESPI interferometer
Author(s): Ricardo Suterio; Armando Albertazzi G.; Felipe Kleber Amaral; Anderson Pacheco
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Paper Abstract

A radial in-plane electronic speckle pattern interferometer (ESPI) is used to measure residual stresses in combination with an indentation method. A semi-empirical mathematical model is developed to quantify the residual stresses from the radial in-plane displacement component measurement around the indentation print. Several tests were made in a specimen with different levels of residual stresses induced by mechanical loading. Correlation functions were fitted to tests results and are used to predict the residual stresses levels. This paper briefly presents the measurement principle, testing details and results of the performance evaluation. Finally, an uncertainty budget of the testing and measurement process was carried out. The tests presented here are not complete since they are restricted to only one material, oneaxis stress state, two indentation tip geometry and only one indentation force, but they are sufficient to encourage further development.

Paper Details

Date Published: 13 June 2005
PDF: 12 pages
Proc. SPIE 5856, Optical Measurement Systems for Industrial Inspection IV, (13 June 2005); doi: 10.1117/12.612615
Show Author Affiliations
Ricardo Suterio, National Institute for Space Research (Brazil)
Federal Univ. of Santa Catarina (Brazil)
Armando Albertazzi G., Federal Univ. of Santa Catarina (Brazil)
Felipe Kleber Amaral, Federal Univ. of Santa Catarina (Brazil)
Anderson Pacheco, Federal Univ. of Santa Catarina (Brazil)

Published in SPIE Proceedings Vol. 5856:
Optical Measurement Systems for Industrial Inspection IV
Wolfgang Osten; Christophe Gorecki; Erik L. Novak, Editor(s)

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