Share Email Print
cover

Proceedings Paper

Laser cutting of CVD diamond wafers
Author(s): Hana Chmelickova; Milan Vanecek; Jan Rosa; Martin Stranyanek
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

CVD diamond has many outstanding physical properties. Because of its extreme hardness, this material is difficult to cut and polish and laser cutting and shaping is a technology of choice. Thick polycrystalline diamond layers were deposited by microwave plasma enhanced chemical vapor deposition on silicon substrates. After synthesis, the silicon substrate was dissolved in an acid mixture and diamond wafer has to be cut into desired shapes according to their future use. With LASAG Nd:YAG pulsed laser system KLS 246-102 we found cutting parameters for different thickness of diamond wafers from 0,1 mm to 0,7 mm. A special support with connection to vacuum was developed to keep small and light parts fixed during processing. To avoid undesirable cracks, laser scribing was used at first. Laser pulse with energy 30 mJ-200 mJ according wafer thickness and velocity 3mm.s-1-15 mm.s-1 goes two or four times along cutting lines. High temperature is the origin of black graphite layers, where absorption of laser radiation continues. Peak power contained in 0,2 ms pulse was up to 1000 W. Developed method helps to prepare CVD diamond samples of any desired shape.

Paper Details

Date Published: 23 March 2005
PDF: 4 pages
Proc. SPIE 5777, XV International Symposium on Gas Flow, Chemical Lasers, and High-Power Lasers, (23 March 2005); doi: 10.1117/12.611274
Show Author Affiliations
Hana Chmelickova, Joint Lab. of Optics, Palacky Univ. (Czech Republic)
Institute of Physics (Czech Republic)
Milan Vanecek, Institute of Physics (Czech Republic)
Jan Rosa, Institute of Physics (Czech Republic)
Martin Stranyanek, Joint Lab. of Optics, Palacky Univ. (Czech Republic)
Institute of Physics (Czech Republic)


Published in SPIE Proceedings Vol. 5777:
XV International Symposium on Gas Flow, Chemical Lasers, and High-Power Lasers
Jarmila Kodymova, Editor(s)

© SPIE. Terms of Use
Back to Top