Share Email Print

Proceedings Paper

Diode laser bonding of planar microfluidic devices, MOEMS, bioMEMS, diagnostic chips, and microarrays
Author(s): Jie-Wei Chen; Jerry M. Zybko
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The assembly of plastic microfluidic devices, MOEMS and microarrays requiring high positioning and welding accuracy in the micrometer range, has been successfully achieved using a new technology based on laser transmission welding combined with a photolithographic mask technique. This paper reviews a laser assembly platform for the joining of microfluidic plastic parts with its main related process characteristics and its potential for low-cost and high volume manufacturing. The system consists of a of diode laser with a mask and an automated alignment function to generate micro welding seams with freely definable geometries. A fully automated mask alignment system with a resolution of < 2 &mu;m and a precise, noncontact energy input allows a fast welding of micro structured plastic parts with high reproducibility and excellent welding quality.

Paper Details

Date Published: 22 January 2005
PDF: 7 pages
Proc. SPIE 5718, Microfluidics, BioMEMS, and Medical Microsystems III, (22 January 2005); doi: 10.1117/12.609874
Show Author Affiliations
Jie-Wei Chen, Leister Process Technologies (Switzerland)
Jerry M. Zybko, Leister Technologies, LLC (United States)

Published in SPIE Proceedings Vol. 5718:
Microfluidics, BioMEMS, and Medical Microsystems III
Ian Papautsky; Isabelle Chartier, Editor(s)

© SPIE. Terms of Use
Back to Top