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Proceedings Paper

Temperature effects on circuit synchronism
Author(s): Sebastian A. Bota; Josep L. Rossello; Marcos Rosales; Jaume Segura
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Paper Abstract

The performance increase of VLSI circuits is leading to increase power dissipation and operation temperature, consequently management of thermally related issues is rapidly becoming one of the most challenging efforts in high performance IC design. Within die temperature gradients on silicon can occur due to different activity maps and in high performance ICs differences as high as 50 °C can be achieved during normal operation. Clock network constitutes one of the most critical elements in synchronous circuits and has a significant impact on speed, area and power dissipation. Due to the well-known impact of temperature on delay, the effect of non-uniform thermal maps on the clock skew can acquire a significant relevance. In this work we analyze the impact of within die thermal gradients on the clock skew considering the dependence on temperature on both active devices and interconnects.

Paper Details

Date Published: 30 June 2005
PDF: 10 pages
Proc. SPIE 5837, VLSI Circuits and Systems II, (30 June 2005); doi: 10.1117/12.608798
Show Author Affiliations
Sebastian A. Bota, Univ. de les Illes Balears (Spain)
Josep L. Rossello, Univ. de les Illes Balears (Spain)
Marcos Rosales, Univ. de les Illes Balears (Spain)
Jaume Segura, Univ. de les Illes Balears (Spain)

Published in SPIE Proceedings Vol. 5837:
VLSI Circuits and Systems II
Jose Fco. Lopez; Francisco V. Fernandez; Jose Maria Lopez-Villegas; Jose M. de la Rosa, Editor(s)

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