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Proceedings Paper

CAD tool environment for MEMS process design support
Author(s): T. Schmidt; A. Wagener; J. Popp; K. Hahn; R. Bruck
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Paper Abstract

MEMS fabrication processes are characterized by a numerous useable process steps, materials and effects to fabricate the intended microstructure. Up to now CAD support in this domain concentrates mainly on the structural design (e.g. simulation programs on FEM basis). These tools often assume fixed interfaces to fabrication process like material parameters or design rules. Taking into account that MEMS design requires concurrently structural design (defining the lateral 2-dim shapes) as well as process design (responsible for the third dimension) it turns out that technology interfaces consisting only of sets of static data are no longer sufficient. For successful design flows in these areas it is necessary to incorporate a higher degree of process related data. A broader interface between process configuration on the one side and the application design on the other side seems to be needed. This paper proposes a novel approach. A process management system is introduced. It allows the specification of processes for specific applications. The system is based on a dedicated database environment that is able to store and manage all process related design constraints linked to the fabrication process data itself. The interdependencies between application specific processes and all stages of the design flow will be discussed and the complete software system PRINCE will be introduced meeting the requirements of this new approach. Based on a concurrent design methodology presented in the beginning of this paper, a system is presented that supports application specific process design. The paper will highlight the incorporated tools and the present status of the software system. A complete configuration of an Si-thin film process example will demonstrate the usage of PRINCE.

Paper Details

Date Published: 1 July 2005
PDF: 8 pages
Proc. SPIE 5836, Smart Sensors, Actuators, and MEMS II, (1 July 2005); doi: 10.1117/12.608517
Show Author Affiliations
T. Schmidt, Univ. of Siegen (Germany)
A. Wagener, Univ. of Siegen (Germany)
J. Popp, Univ. of Siegen (Germany)
K. Hahn, Univ. of Siegen (Germany)
R. Bruck, Univ. of Siegen (Germany)


Published in SPIE Proceedings Vol. 5836:
Smart Sensors, Actuators, and MEMS II
Carles Cane; Jung-Chih Chiao; Fernando Vidal Verdu, Editor(s)

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