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Proceedings Paper

Post-processing gap reduction in a micromachined resonator for vacuum pressure measurement
Author(s): Detlef Billep; Karla Hiller; Jorg Fromel; Dirk Tenholte; Danny Reuter; Wolfram Dotzel; Thomas Gessner
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Paper Abstract

This paper describes the application of a micromachined resonator to verify the vacuum pressure and sealing of cavities in micromechanical components. We use an electrostatic driven and capacitively sensed bulk silicon resonator fabricated by Bonding and Deep Reactive Ion Etching (BDRIE) technology. The resonator operates at the first fundamental frequency. The damping is used as a degree of the pressure. Transversal comb structures act as squeeze film damping sources. Post-processing gap reduction substructures are used to increase the damping in the vacuum pressure range. This method makes it possible to observe the pressure over the time of smallest gas volumes by monitoring the damping of integrated micro mechanical resonant structures. Therewith it is possible to estimate the hermetic sealing quality of the closed sensor package. A transfer curve with a logarithmic characteristic is measured.

Paper Details

Date Published: 1 July 2005
PDF: 10 pages
Proc. SPIE 5836, Smart Sensors, Actuators, and MEMS II, (1 July 2005); doi: 10.1117/12.608312
Show Author Affiliations
Detlef Billep, Chemnitz Univ. of Technology (Germany)
Karla Hiller, Chemnitz Univ. of Technology (Germany)
Jorg Fromel, Fraunhofer Institute for Reliability and Microintegration (Germany)
Dirk Tenholte, Chemnitz Univ. of Technology (Germany)
Danny Reuter, Chemnitz Univ. of Technology (Germany)
Wolfram Dotzel, Chemnitz Univ. of Technology (Germany)
Thomas Gessner, Chemnitz Univ. of Technology (Germany)
Fraunhofer Institute for Reliability and Microintegration (Germany)

Published in SPIE Proceedings Vol. 5836:
Smart Sensors, Actuators, and MEMS II
Carles Cane; Jung-Chih Chiao; Fernando Vidal Verdu, Editor(s)

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