Share Email Print

Proceedings Paper

Research for polyimide as a sacrificial layer in MEMS device
Author(s): Meili Hu; Jinjin Chen; Zhongshen Lai; Huibing Mao; Dexin Sheng
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Polyimide has been an important sacrificial layer material in the MEMS switch. Polyimide can be spun and photographied on silicon substrate. NaOH liquid can etch and develop polyimide. Then it needs to cure. After MEMS switch are manufactured, polyimide must be removed. The different cure temperature and time impacts the character of polyimide. The experiment result shows that it is easy to remove and can be lithographed. So it is suitable for microwave device. In this paper, refers that polyimide can be etched by NaOH, O2 and CF4.

Paper Details

Date Published: 8 December 2004
PDF: 4 pages
Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); doi: 10.1117/12.608035
Show Author Affiliations
Meili Hu, East China Normal Univ. (China)
Jinjin Chen, East China Normal Univ. (China)
Zhongshen Lai, East China Normal Univ. (China)
Huibing Mao, East China Normal Univ. (China)
Dexin Sheng, East China Normal Univ. (China)

Published in SPIE Proceedings Vol. 5774:
Fifth International Conference on Thin Film Physics and Applications
Junhao Chu; Zongsheng Lai; Lianwei Wang; Shaohui Xu, Editor(s)

© SPIE. Terms of Use
Back to Top