Share Email Print
cover

Proceedings Paper

Selective formation of porous silicon array using highly resistive silicon layer as masking materials
Author(s): Xiaohua Wang; Shaoqiang Chen; Jian Zhang; Jianzhong Zhu; Ziqiang Zhu
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A new technology using ion implantation technique to create the selectively patterned porous silicon structures is presented in this paper. Hydrogen ions were first selectively implanted into silicon substrates and resulted in a highly resistive silicon layer. This layer can be used as a mask to selectively etch the un-implanted areas by electrochemical etching of crystalline silicon in HF-based solutions and lead to the formation of PS arrays. The quality of resulted PS were characterized by the analysis tools like SEM, AFM, etc. It is concluded that the ion implanted silicon can be used as the mask material for the selectively formation of PS patterns. The masking capability of the implanted Si layer is dependent upon the implantation conditions. The relationship between the masking capability of highly resistive silicon layer and the implantation condition (parameters like dose, time) were discussed. The developed technique is quite simple and can be used to form the fine PS patterns.

Paper Details

Date Published: 8 December 2004
PDF: 4 pages
Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); doi: 10.1117/12.608007
Show Author Affiliations
Xiaohua Wang, East China Normal Univ. (China)
Shaoqiang Chen, East China Normal Univ. (China)
Jian Zhang, East China Normal Univ. (China)
Jianzhong Zhu, East China Normal Univ. (China)
Ziqiang Zhu, East China Normal Univ. (China)


Published in SPIE Proceedings Vol. 5774:
Fifth International Conference on Thin Film Physics and Applications
Junhao Chu; Zongsheng Lai; Lianwei Wang; Shaohui Xu, Editor(s)

© SPIE. Terms of Use
Back to Top