Share Email Print
cover

Proceedings Paper

Bond enhance of hydroxyapatite/silicon layers by introducing a porous silicon interlayer
Author(s): Shaoqiang Chen; Jianzhong Zhu; Jian Zhang; Xiao Feng; Yanling Shi; Xiaohua Wang; Laiqiang Luo; Ziqiang Zhu
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Hydroxyapatite (HAP) nano-particles obtained by coprecipitate process are deposited on porous silicon substrates, after being annealed, HAP films connected tightly with porous silicon substrates. The resulted samples were investigated by XRD, AFM and SEM.

Paper Details

Date Published: 8 December 2004
PDF: 4 pages
Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); doi: 10.1117/12.607803
Show Author Affiliations
Shaoqiang Chen, East China Normal Univ. (China)
Jianzhong Zhu, East China Normal Univ. (China)
Jian Zhang, East China Normal Univ. (China)
Xiao Feng, East China Normal Univ. (China)
Yanling Shi, East China Normal Univ. (China)
Xiaohua Wang, East China Normal Univ. (China)
Laiqiang Luo, East China Normal Univ. (China)
Ziqiang Zhu, East China Normal Univ. (China)


Published in SPIE Proceedings Vol. 5774:
Fifth International Conference on Thin Film Physics and Applications
Junhao Chu; Zongsheng Lai; Lianwei Wang; Shaohui Xu, Editor(s)

© SPIE. Terms of Use
Back to Top