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Proceedings Paper

A novel application of the solid electrolyte thin film for preparing copper nanowires
Author(s): Shuo Shi; Jia-Lin Sun; Guo-Sheng Zhang; Jian-Hong Zhang; Ji-Hua Guo; Zheng-Ping Wang
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Paper Abstract

We report a novel application of the solid electrolyte K-Cu-I thin film for preparing copper nanowires. The K-Cu-I film was prepared by depositing a mixture of KI and CuI powders on a heated glass substrate in vacuum and had a copper ion conductivity of 1.5x10-3Ω-1cm-1 at 540K. At 540K, being applied a direct current (DC) electric field of 1.0x104 V/m, the copper ions migrated toward cathode through the K-Cu-I film and congregated to form nanowires at the edge of the cathode. The copper nanowires were about 40~100nm in diameter and several micrometers in length.

Paper Details

Date Published: 8 December 2004
PDF: 4 pages
Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); doi: 10.1117/12.607384
Show Author Affiliations
Shuo Shi, Tsinghua Univ. (China)
Jia-Lin Sun, Tsinghua Univ. (China)
Guo-Sheng Zhang, Harbin Engineering Univ. (China)
Jian-Hong Zhang, Tsinghua Univ. (China)
Ji-Hua Guo, Tsinghua Univ. (China)
Zheng-Ping Wang, Harbin Engineering Univ. (China)


Published in SPIE Proceedings Vol. 5774:
Fifth International Conference on Thin Film Physics and Applications
Junhao Chu; Zongsheng Lai; Lianwei Wang; Shaohui Xu, Editor(s)

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