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Proceedings Paper

High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems
Author(s): Gee-Kung Chang; Daniel Guidotti; Zhaoran Rena Huang; Lixi Wan; Jianjun Yu; Shashikant Hegde; Hung-Fei Kuo; Yin-Jung Chang; Fuhan Liu; Fentao Wang; Rao Tummala
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Paper Abstract

Recent progress toward implementing high-density, optical-digital building blocks necessary to accomplish efficient, end-to-end optical interconnect architecture on low cost FR-4 boards has been demonstrated. The optical interconnect system consists of fabricating an optical buffer layer separating board metallurgy from the optical lightwave circuit layer, and implementing optical links between embedded lasers and detectors. We will show an example of 1310 nm light from an edge emitting distributed-feedback or Fabry-Perot laser operating at 10 Gb/s being guided to the photo-detector by a polymer waveguide. Both lasers and detector are embedded in the waveguide and all construction is built on a low-cost FR-4 board with 3 levels of metallurgy.

Paper Details

Date Published: 24 May 2005
PDF: 15 pages
Proc. SPIE 5814, Enabling Photonics Technologies for Defense, Security, and Aerospace Applications, (24 May 2005); doi: 10.1117/12.606958
Show Author Affiliations
Gee-Kung Chang, Georgia Institute of Technology (United States)
Daniel Guidotti, Georgia Institute of Technology (United States)
Zhaoran Rena Huang, Rensselaer Polytechnic Institute (United States)
Lixi Wan, Georgia Institute of Technology (United States)
Jianjun Yu, Georgia Institute of Technology (United States)
Shashikant Hegde, Georgia Institute of Technology (United States)
Hung-Fei Kuo, Georgia Institute of Technology (United States)
Yin-Jung Chang, Georgia Institute of Technology (United States)
Fuhan Liu, Georgia Institute of Technology (United States)
Fentao Wang, Georgia Institute of Technology (United States)
Rao Tummala, Georgia Institute of Technology (United States)


Published in SPIE Proceedings Vol. 5814:
Enabling Photonics Technologies for Defense, Security, and Aerospace Applications
Andrew R. Pirich; Michael J. Hayduk; Eric J. Donkor; Peter J. Delfyett, Editor(s)

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