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Proceedings Paper

Solder jet technology for advanced packaging
Author(s): C. Gallagher; P. J. Hughes; P. Tassie; K. Rodgers; J. Barton; J. Justice; D. P. Casey
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Paper Abstract

Lowering optical packaging costs requires developments in new technologies. In this paper, solder ink-jet process is presented for flip-chip component assembly on planar, 3D, flex and stacked submounts and substrates. Applications for this technology are presented and include linear array in-vivo dosimeters, integrated GaN LED displays, telecomm submounts and wearable ambient systems. An important aspect of developing this technology is process reliability. In this study, the reliability of the solder to bump accurately and adhere to various target bond pads was evaluated as well as MIL standard shear tests to qualify the joint strength of the bump.

Paper Details

Date Published: 3 June 2005
PDF: 7 pages
Proc. SPIE 5825, Opto-Ireland 2005: Optoelectronics, Photonic Devices, and Optical Networks, (3 June 2005); doi: 10.1117/12.605679
Show Author Affiliations
C. Gallagher, Tyndall National Institute (Ireland)
P. J. Hughes, Tyndall National Institute (Ireland)
P. Tassie, Tyndall National Institute (Ireland)
K. Rodgers, Tyndall National Institute (Ireland)
J. Barton, Tyndall National Institute (Ireland)
J. Justice, Tyndall National Institute (Ireland)
D. P. Casey, Tyndall National Institute (Ireland)

Published in SPIE Proceedings Vol. 5825:
Opto-Ireland 2005: Optoelectronics, Photonic Devices, and Optical Networks
John Gerard McInerney; Harold S. Gamble; Gerald Farrell; David M. Denieffe; Padraig Hughes; R. Alan Moore; Liam Barry, Editor(s)

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