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Proceedings Paper

Micro-machining for industrial applications
Author(s): Mohammed Naeem; Peter Collins
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Paper Abstract

The increasing complexity of microelectronics/ engineering devices and the requirement for higher yields and automated production systems place stringent demands on the assembly techniques and performance requirements of materials, machining and joining techniques. This has led to increasing interest in the use of low power lasers for machining, welding, soldering and marking of small assemblies. Of particular interest to micro-component industries is the ability of such lasers to apply controlled amounts of energy in precise areas, utilizing extremely low heat input, resulting in very low distortion, and coupled with the ability to operate at high production rates in a flexible manner. The majority of these applications comprise thin materials, less than 1mm thickness. This paper describes some of the cutting, joining, drilling and marking results achieved with a high beam quality low power pulsed Nd: YAG laser.

Paper Details

Date Published: 8 June 2005
PDF: 11 pages
Proc. SPIE 5827, Opto-Ireland 2005: Photonic Engineering, (8 June 2005); doi: 10.1117/12.605300
Show Author Affiliations
Mohammed Naeem, GSI Lumonics (United Kingdom)
Peter Collins, GSI Lumonics (United Kingdom)

Published in SPIE Proceedings Vol. 5827:
Opto-Ireland 2005: Photonic Engineering
Thomas J. Glynn; John T. Sheridan; Brian W. Bowe; Ronan F. O'Dowd; Gerard M. O'Connor; Aidan J.H. Flanagan; Gerard D. O'Sullivan; Gerald Byrne; Jonathan Magee, Editor(s)

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