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Proceedings Paper

Integrating DfM components into a cohesive design-to-silicon solution
Author(s): Lars Liebmann; Dan Maynard; Kevin McCullen; Nakgeuon Seong; Ed Buturla; Mark Lavin; Jason Hibbeler
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Paper Abstract

Two primary tracks of DfM, one originating from physical design characterization, the other from low-k1 lithography, are described. Examples of specific DfM efforts are given and potentially conflicting layout optimization goals are pointed out. The need for an integrated DfM solution than ties together currently parallel DfM efforts of increasing sophistication and layout impact is identified and a novel DfM-enabling design flow is introduced.

Paper Details

Date Published: 5 May 2005
PDF: 12 pages
Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); doi: 10.1117/12.604723
Show Author Affiliations
Lars Liebmann, IBM Systems and Technology Group (United States)
Dan Maynard, IBM Systems and Technology Group (United States)
Kevin McCullen, IBM Systems and Technology Group (United States)
Nakgeuon Seong, IBM Systems and Technology Group (United States)
Ed Buturla, IBM Systems and Technology Group (United States)
Mark Lavin, IBM Corp. (United States)
Jason Hibbeler, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 5756:
Design and Process Integration for Microelectronic Manufacturing III
Lars W. Liebmann, Editor(s)

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