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Proceedings Paper

FPA technology advancements at Rockwell Scientific
Author(s): Tom Chuh
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Paper Abstract

Progress of selected FPA (Focal Plane Array) technology development at Rockwell Scientific Company is reviewed: very large format monolithic visible CMOS, hybrid silicon pin visible CMOS, ultra high frame rate (360ns interframe time) burst mode camera, substrate removed HgCdTe infrared detectors for continuous visible through infrared spectral sensitivity, astronomical focal plane arrays, mosaic (16 megapixel) infrared FPAs, JWST, and the SIDECAR ASIC readout interface chip.

Paper Details

Date Published: 31 May 2005
PDF: 16 pages
Proc. SPIE 5783, Infrared Technology and Applications XXXI, (31 May 2005); doi: 10.1117/12.604169
Show Author Affiliations
Tom Chuh, Rockwell Scientific Co. (United States)


Published in SPIE Proceedings Vol. 5783:
Infrared Technology and Applications XXXI
Bjorn F. Andresen; Gabor F. Fulop, Editor(s)

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