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Proceedings Paper

Actively cooled SLMS technology for HEL applications
Author(s): Marc T. Jacoby; William A. Goodman; Jack C. Reily; Jeffrey R. Kegley; Harlan J. Haight; John Tucker; Ernest R. Wright; William D. Hogue
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Paper Abstract

Schafer has demonstrated two different methods for actively cooling our Silicon Lightweight Mirror System (SLMSTM) technology. Direct internal cooling was accomplished by flowing liquid nitrogen through the continuous open cell core of the SLMSTM mirror. Indirect external cooling was accomplished by flowing liquid nitrogen through a CTE matched Cesic® square-tube manifold that was bonded to the back of the mirror in the center. Testing was done in the small 4- foot thermal/vacuum chamber located at the NASA/MSFC X-Ray Calibration Facility. Seven thermal diodes were located over the front side of the 5 inch diameter mirror and one was placed on the outlet side of the Cesic® manifold. Results indicate that the mirror reaches steady state at 82K in less than four minutes for both cooling methods. The maximum temperature difference of the eight diodes was less than 200 mK when the mirror was internally cooled and covered with MLI to insulate it from the large 300 K aluminum plate that was used to mount it.

Paper Details

Date Published: 1 June 2005
PDF: 12 pages
Proc. SPIE 5792, Laser Source and System Technology for Defense and Security, (1 June 2005); doi: 10.1117/12.603632
Show Author Affiliations
Marc T. Jacoby, Schafer Corp. (United States)
William A. Goodman, Schafer Corp. (United States)
Jack C. Reily, NASA/MSFC (United States)
Jeffrey R. Kegley, NASA/MSFC (United States)
Harlan J. Haight, NASA/MSFC (United States)
John Tucker, NASA/MSFC (United States)
Ernest R. Wright, NASA/MSFC (United States)
William D. Hogue, NASA/MSFC (United States)


Published in SPIE Proceedings Vol. 5792:
Laser Source and System Technology for Defense and Security
Gary L. Wood, Editor(s)

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