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Proceedings Paper

Microsystem for signal processing applications
Author(s): B. Frankenstein; K.-J. Froehlich; D. Hentschel; G. Reppe
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Paper Abstract

Acoustic monitoring of technological processes requires methods that eliminate noise as much as possible. Sensor-near signal evaluation can contribute substantially. Frequently, a further necessity exists to integrate the measuring technique in the monitored structure. The solution described contains components for analog preprocessing of acoustic signals, their digitization, algorithms for data reduction, and digital communication. The core component is a digital signal processor (DSP). Digital signal processors perform the algorithms necessary for filtering, down sampling, FFT computation and correlation of spectral components particularly effective. A compact, sensor-near signal processing structure was realized. It meets the Match-X standard, which as specified by the German Association for Mechanical and Plant Engineering (VDMA) for development of micro-technical modules, which can be combined to applicaiton specific systems. The solution is based on AL2O3 ceramic components including different signal processing modules as ADC, as well as memory and power supply. An arbitrary waveform generator has been developed and combined with a power amplifier for piezoelectric transducers in a special module. A further module interfaces to these transducers. It contains a multi-channel preamplifier, some high-pass filters for analog signal processing and an ADC-driver. A Bluetooth communication chip for wireless data transmission and a DiscOnChip module are under construction. As a first application, the combustion behavior of safety-relevant contacts is monitored. A special waveform up to 5MHz is produced and sent to the monitored object. The resulting signal form is evaluated with special algorithms, which extract significant parameters of the signal, and transmitted via CAN-bus.

Paper Details

Date Published: 9 May 2005
PDF: 8 pages
Proc. SPIE 5770, Advanced Sensor Technologies for Nondestructive Evaluation and Structural Health Monitoring, (9 May 2005); doi: 10.1117/12.602108
Show Author Affiliations
B. Frankenstein, Fraunhofer Institute for Non-Destructive Testing (Germany)
K.-J. Froehlich, Fraunhofer Institute for Non-Destructive Testing (Germany)
D. Hentschel, Fraunhofer Institute for Non-Destructive Testing (Germany)
G. Reppe, RHe Microsystems (Germany)


Published in SPIE Proceedings Vol. 5770:
Advanced Sensor Technologies for Nondestructive Evaluation and Structural Health Monitoring
Norbert Meyendorf; George Y. Baaklini; Bernd Michel, Editor(s)

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