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Proceedings Paper

Newly developed polymer bound photoacid generator resist for sub-100-nm pattern by EUV lithography
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Paper Abstract

Extreme UV lithography (EUVL) is one of the most promising NGL technologies for sub-100nm resolution. We are developing polymer bound PAG resists for patterning down to the 32 nm node by EUVL. It has been reported that photoacid generators have limited compatibility with the chemically amplified polymer resist matrix that leads to phase separation, non-uniform acid distribution and migration during the baking process. To alleviate these problems, it is proposed that PAG units be incorporated in the resist chains, rather than adding monomeric PAG in to the resist polymer. The polymer bound PAG resists, poly (4-hydroxystyrene-co-2-ethyl-2-adamantyl methacrylate-co-PAG) were synthesized with different PAG loading (2% to 10.5%) using free radical polymerization. These resists contain the bulky adamantly protecting group to improve lithographic performance. The incorporation of photoacid generators (ionic and covalent) in the main chain of the polymer enhanced sensitivity and contrast compared to conventional PMMA resist and polymer with blend PAG. It was found that the sample with 5% PAG loading in the main chain gave sub 50 nm features using EUV exposure.

Paper Details

Date Published: 4 May 2005
PDF: 7 pages
Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); doi: 10.1117/12.602087
Show Author Affiliations
Kenneth E. Gonsalves, Univ. of North Carolina/Charlotte (United States)
Muthiah Thiyagarajan, Univ. of North Carolina/Charlotte (United States)
Kim Dean, SEMATECH, Inc. (United States)


Published in SPIE Proceedings Vol. 5753:
Advances in Resist Technology and Processing XXII
John L. Sturtevant, Editor(s)

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