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Proceedings Paper

Using yield-focused design methodologies to speed time-to-market
Author(s): Marc Levitt
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Paper Abstract

As manufacturers employ emerging advances in lithographic technologies, the need for complementary improvements in design processes becomes critical. In moving to nanometer technology nodes at 90nm and below, semiconductor companies will face increased challenges for optimizing yield beyond traditional post-processing methods. Instead, increasing responsibility for yield improvement will focus on lithography-friendly design methodologies and adoption of improved design-for-manufacturability (DFM) practices able to address manufacturing yield issues from first silicon, into production ramp-up and during volume manufacturing. Among emerging DFM practices, "yield-focused" design tools and methodologies address yield-loss mechanisms arising with nanometer technologies. By employing these emerging tools and methodologies, engineers can address manufacturing-induced yield problems early in the design process and through manufacturing.

Paper Details

Date Published: 5 May 2005
PDF: 8 pages
Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); doi: 10.1117/12.601945
Show Author Affiliations
Marc Levitt, Cadence Design Systems, Inc. (United States)

Published in SPIE Proceedings Vol. 5756:
Design and Process Integration for Microelectronic Manufacturing III
Lars W. Liebmann, Editor(s)

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