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Proceedings Paper

Flip chip VCSEL arrays on transparent substrates
Author(s): Bryan Gregory; Randy Wickman
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Paper Abstract

In this report, we will discuss a method utilized by Emcore to flip-chip VCSEL die arrays onto transparent substrates, which contain integrated lensing and hybrid drive circuits. This process enables very dense hybrid packages.

Paper Details

Date Published: 14 March 2005
PDF: 8 pages
Proc. SPIE 5737, Vertical-Cavity Surface-Emitting Lasers IX, (14 March 2005); doi: 10.1117/12.601943
Show Author Affiliations
Bryan Gregory, Emcore Corp. (United States)
Randy Wickman, Emcore Corp. (United States)


Published in SPIE Proceedings Vol. 5737:
Vertical-Cavity Surface-Emitting Lasers IX
Chun Lei; Kent D. Choquette, Editor(s)

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