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Proceedings Paper

Long-term 193-nm laser irradiation of thin-film-coated CaF2 in the presence of H2O
Author(s): V. Liberman; M. Switkes; M. Rothschild; S. T. Palmacci; J. H. C. Sedlacek; D. E. Hardy; A. Grenville
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Paper Abstract

The final projection lens element in a 193-nm immersion-based lithographic tool will be in direct contact with water during irradiation. Thus, any lifetime considerations for the lens must include durability data of lens materials and thin films in a water ambient. We have previously shown that uncoated CaF2 is attacked by water in a matter of hours, as manifested by a substantial increase in AFM-measured surface roughness.1 Thus, CaF2 lenses must be protected, possibly by a thin film, and the coatings tested for laser durability in water. To address the above lifetime concerns, we have constructed a marathon laser-irradiation system for testing thin film exposure to water under long-term laser irradiation. Coated substrates are loaded into a custom water cell, made of stainless steel and Teflon parts. Ultrapure water is delivered from a water treatment testbed that includes particle filtration, deionization and degassing stages. In-situ metrology includes 193-nm laser ratiometry, UV spectrophotometry and spectroscopic ellipsometry, all with spatial profiling capabilities. In-situ results are coupled with off-line microscopy, AFM measurements and spatial surface mapping with spectroscopic ellipsometry at multiple incidence angles. A variety of laser-induced changes have been observed, from complete adhesion loss of protective coatings to more subtle changes, such as laser-induced index changes of the thin films or surface roughening. Implications of the study on expected lifetimes of the protective coatings in the system will be discussed.

Paper Details

Date Published: 12 May 2004
PDF: 9 pages
Proc. SPIE 5754, Optical Microlithography XVIII, (12 May 2004); doi: 10.1117/12.601468
Show Author Affiliations
V. Liberman, Lincoln Lab., Massachusetts Institute of Technology (United States)
M. Switkes, Lincoln Lab., Massachusetts Institute of Technology (United States)
M. Rothschild, Lincoln Lab., Massachusetts Institute of Technology (United States)
S. T. Palmacci, Lincoln Lab., Massachusetts Institute of Technology (United States)
J. H. C. Sedlacek, Lincoln Lab., Massachusetts Institute of Technology (United States)
D. E. Hardy, Lincoln Lab., Massachusetts Institute of Technology (United States)
A. Grenville, Intel Corp./International SEMATECH (United States)


Published in SPIE Proceedings Vol. 5754:
Optical Microlithography XVIII
Bruce W. Smith, Editor(s)

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