Share Email Print
cover

Proceedings Paper

Effects of wet-cleans and surface treatments on the adhesion of a photoresist to HDP-oxide substrate
Author(s): Shih-Chi Fu; Jieh-Jang Chen; Feng-Jia Shiu; Ching-Sen Kuo; Gwo-Yun Shiau; Chia-Shiung Tsia; Chung Wang
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Adhesion of photoresist (PR) on substrate is one of the key issues in photolithography. Poor adhesion force between PR and substrate will cause patterns dislocated or peeled in the TMAH developing or water spin-dry process. This becomes a more serious issue in 130nm and below technology as the defects from poor PR adhesion were much more easily found by using ArF PR than by KrF or I-line ones. Besides, the defect counts of PR peeling were also found much influenced by the wet-cleans of the oxide substrate before photo process. This dependence is less observed in using KrF or I-line PRs. To understand why some wet-cleans cause serious PR lifting and what method would be effective in avoiding this issue, the interaction force between PR and oxide surface by different wet-cleans process were calculated by contact-angle measurement, and the surface state were compared by IR/AFM/XPS. The result indicates the adhesion force for ArF PR and oxide substrate is lowered by some wet-clean methods, and more dangling SiOH bonding, or more hydrophilic properties were also found through surface analysis. The contact-angle measurements may serve as a convenient index of how safety the process is free from adhesion problem. Many advices to avoid the similar event in the process development were summarized in the last.

Paper Details

Date Published: 4 May 2005
PDF: 7 pages
Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); doi: 10.1117/12.601435
Show Author Affiliations
Shih-Chi Fu, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Jieh-Jang Chen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Feng-Jia Shiu, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Ching-Sen Kuo, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Gwo-Yun Shiau, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chia-Shiung Tsia, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chung Wang, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)


Published in SPIE Proceedings Vol. 5753:
Advances in Resist Technology and Processing XXII
John L. Sturtevant, Editor(s)

© SPIE. Terms of Use
Back to Top