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Proceedings Paper

Development of an electro-optical MCM to produce a multichannel transceiver using VCSEL arrays
Author(s): Pierre Avner Badihi; Sylvie Rockman; Hanan Yinnon; Yaniv Rotem
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Paper Abstract

This article describes the implementation of VCSELs as light sources for a chip-scale, highly dense multi-channel transmitter and receiver. The VCSELs are implemented using flip chip technology, as part of a hybrid process for the fabrication of an integrated photonic chip, using standard semi-conductor processes. The results as published indicate that integrated photonic chips may be applicable for various high speed datacom applications where copper use is restricted.

Paper Details

Date Published: 14 March 2005
PDF: 7 pages
Proc. SPIE 5737, Vertical-Cavity Surface-Emitting Lasers IX, (14 March 2005); doi: 10.1117/12.601049
Show Author Affiliations
Pierre Avner Badihi, XLoom Communications, Inc. (Israel)
Sylvie Rockman, XLoom Communications, Inc. (Israel)
Hanan Yinnon, XLoom Communications, Inc. (Israel)
Yaniv Rotem, XLoom Communications, Inc. (Israel)

Published in SPIE Proceedings Vol. 5737:
Vertical-Cavity Surface-Emitting Lasers IX
Chun Lei; Kent D. Choquette, Editor(s)

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