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Proceedings Paper

65nm OPC and design optimization by using simple electrical transistor simulation
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Paper Abstract

In the context of 65nm logic technology where gate CD control budget requirements are below 5nm, it is mandatory to properly quantify the impact of the 2D effects on the electrical behavior of the transistor [1,2]. This study uses the following sequence to estimate the impact on transistor performance: 1) A lithographic simulation is performed after OPC (Optical Proximity Correction) of active and poly using a calibrated model at best conditions. Some extrapolation of this model can also be used to assess marginalities due to process window (focus, dose, mask errors, and overlay). In our case study, we mainly checked the poly to active misalignment effects. 2) Electrical behavior of the transistor (Ion, Ioff, Vt) is calculated based on a derivative spice model using the simulated image of the gate as an input. In most of the cases Ion analysis, rather than Vt or leakage, gives sufficient information for patterning optimization. We have demonstrated the benefit of this approach with two different examples: -design rule trade-off : we estimated the impact with and without misalignment of critical rules like poly corner to active distance, active corner to poly distance or minimum space between small transistor and big transistor. -Library standard cell debugging: we applied this methodology to the most critical one hundred transistors of our standard cell libraries and calculate Ion behavior with and without misalignment between active and poly. We compared two scanner illumination modes and two OPC versions based on the behavior of the one hundred transistors. We were able to see the benefits of one illumination, and also the improvement in the OPC maturity.

Paper Details

Date Published: 5 May 2005
PDF: 11 pages
Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); doi: 10.1117/12.600887
Show Author Affiliations
Yorick Trouiller, CEA-LETI (France)
Thierry Devoivre, STMicroelectronics (France)
Jerome Belledent, Philips Semiconductors (France)
Franck Foussadier, STMicroelectronics (France)
Amandine Borjon, Philips Semiconductors (France)
Kyle Patterson, Freescale Semiconductor (France)
Kevin Lucas, Freescale Semiconductor (France)
Christophe Couderc, Philips Semiconductors (France)
Frank Sundermann, STMicroelectronics (France)
Jean-Christophe Urbani, STMicroelectronics (France)
Stanislas Baron, STMicroelectronics (France)
Yves Rody, Philips Semiconductors (France)
Jean-Damien Chapon, STMicroelectronics (France)
Franck Arnaud, STMicroelectronics (France)
Jorge Entradas, Mentor Graphics Corp. (France)


Published in SPIE Proceedings Vol. 5756:
Design and Process Integration for Microelectronic Manufacturing III
Lars W. Liebmann, Editor(s)

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