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Proceedings Paper

Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops
Author(s): Hermann H. Oppermann; Matthias Hutter; Gunter Engelmann; Herbert Reichl
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Paper Abstract

Assembly of single mode laser diodes requires a post bond alignment accuracy of less than 1 μm. The implementation of passive alignment in optoelectronics packaging is still a challenge. A low cost approach to achieve such high precision alignment is using the flip chip self alignment mechanism in combination with micro-mechanical stops. In order to prove that this approach is feasible test vehicles were designed and fabricated. This paper presents the concept of passive alignment pursued, the experimental setup and results thereof. The design of the test vehicles is described including the bump design as well as bumping and flip chip assembly process.

Paper Details

Date Published: 22 January 2005
PDF: 7 pages
Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); doi: 10.1117/12.600798
Show Author Affiliations
Hermann H. Oppermann, Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration (Germany)
Matthias Hutter, Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration (Germany)
Gunter Engelmann, Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration (Germany)
Herbert Reichl, Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration (Germany)


Published in SPIE Proceedings Vol. 5716:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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